06.05.2021

HP Inc. corporate bonds (US40434LAC90): NSD accepted for services this issue


Issue Details
Date of acceptance May 6, 2021
Issuer HP Inc.
Security Type corporate bonds
Security Name HP Inc. 3.4 17/06/30
ISIN / NSD Code US40434LAC90
Date of Placement June 17, 2020
Face Value 1 000.00
Currency USD
Number of Securities in the Issue (in items) 850 000
Maturity Date June 17, 2030
Duration (in days) 3652
Number of Coupons 1
Head Depository EUROCLEAR

If you have any questions related to this communication, please contact your account managers at NSD by telephone: +7 495 956-27-90 or +7 495 956-27-91.

Print page